AVARY HOLDING (SHENZHEN) CO., LIMITED.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 53103
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM4153
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 319
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2123
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 2100
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 290
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 272
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B21D WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING 155
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0020,538 MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARDSep 27, 17Jan 18, 18[H05K]
2017/0367,191 PRINTED CIRCUIT BOARDAug 30, 17Dec 21, 17[H05K]
2017/0354,030 HIGH FREQUENCY SIGNAL TRANSMISSION STRUCTURE AND METHOD FOR SAMESep 26, 16Dec 07, 17[H05K]
2017/0275,508 RESIN COMPOSITION AND ADHESIVE FILM AND CIRCUIT BOARD MADE OF THE SAMEJun 23, 16Sep 28, 17[C09J, C08L, H05K, B32B]
2017/0188,451 FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAMEMar 23, 16Jun 29, 17[H05K]
2017/0079,136 CIRCUIT BOARD AND METHOD FOR MAKING THE SAMEOct 22, 15Mar 16, 17[H05K]
2016/0366,766 CIRCUIT BOARD, METHOD FOR MAKING THE SAME, AND PORTABLE ELECTRONIC DEVICE EMPLOYING THE SAMEOct 19, 15Dec 15, 16[H05K]
2016/0320,142 THIN HEAT DISSIPATION FOIL AND METHOD FOR MANUFACTURING SAMEAug 26, 15Nov 03, 16[F28D, B32B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9907167 Method for manufacturing a printed circuit board with high-capacity copper circuitDec 29, 16Feb 27, 18[H05K]
9872393 Method for making a circuit boardOct 19, 15Jan 16, 18[H01K, H05K]
9860977 Transparent flexible printed circuit board and method for manufacturing the sameAug 02, 17Jan 02, 18[H05K]
9832888 Circuit board and method for making the sameJun 24, 16Nov 28, 17[H05K]
9820388 Printed circuit board and method for manufacturing sameAug 12, 14Nov 14, 17[H05K]
9807868 Method for making conductive polymer, and composite film and circuit board having the conductive polymerSep 23, 16Oct 31, 17[C08F, C09D, H01B, H05K, C08K]
9807877 Method for making a multilayer flexible printed circuit boardOct 05, 16Oct 31, 17[H05K]
9788437 Method for manufacturing printed circuit board with etching process to partially remove conductive layerSep 09, 15Oct 10, 17[H05K]
9706640 Method for manufacturing printed circuit boardOct 30, 15Jul 11, 17[H05K]
9693448 Flexible circuit board and method for making the sameOct 29, 15Jun 27, 17[H05K]

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Expired/Abandoned/Withdrawn Patents

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